Deposition Process of Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent.
نویسندگان
چکیده
منابع مشابه
Copper electroless plating in weakly alkaline electrolytes using DMAB as a reducing agent for metallization on polymer films
Copper electroless plating at low pH (7–9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on t...
متن کاملProcess analysis of electroless copper plating for AB5- type hydrogen storage alloy using support vector regression
Surface modification is an effective method to improve the electrochemical property of hydrogen storage alloy. In order to investigate the influence of process factors of electroless copper (Cu) plating for AB5-type hydrogen storage alloy on Cu coating mass, a novel modeling approach, support vector regression (SVR) combined with particle swarm optimization (PSO), was proposed to construct a ma...
متن کاملElectroless Plating of Nckel onto Surfaces Such as Copper or Fused Tungston
54 ELECTROLESS PLATING OF NICKELONTO 4,059,710 1 1/1977 Nishiyama .......................... 427/438 SURFACES SUCH AS COPPER OR FUSED 4,136,216 1/1979 Feldstein ....... ... 427/306 TUNGSTON 4,167,416 9/1979 Zola ......... ... 427/438 4,220,678 9/1980 Feldstein ... ... 427/305 75) Inventor: Jon E. Bengston, Newington, Conn. 4,239,813 12/1980 Murakami. ... 427A306 s 4,276,323 6/1981 Oka ............
متن کاملFormation of copper nanowires by electroless deposition using microtubules as templates.
Microtubules (MTs) are self-assembling, protein-based, tubular structures several micrometers long with outer and inner diameters of 25 nm and 15 nm, respectively. This aspect ratio makes MTs ideal templates for producing nanowires for applications such as electrical nano-interconnects. MTs are poorly conductive and their use as interconnects necessitates their metallization. We report a proces...
متن کاملBath and Deposit Monitoring System for Electroless Nickel Plating Process
Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
سال: 1995
ISSN: 1884-1201,1341-0571
DOI: 10.5104/jiep1995.10.118